What are the requirements for air compressed air quality requirements for semiconductor packaging components

Semiconductor packaging components have extremely strict requirements on air compressed air quality to ensure the cleanliness of the production environment and the quality of the product. The specific requirements are as follows:

1. Oil content requirements

• Requirements: The oil content in air compressed air must be very low, and the total oil content is usually required to be less than 1ppm, or even 0.00ppm.
• Cause: The oil component will cause contamination to semiconductor packaging components, affecting the performance and reliability of components. Especially during the manufacturing process of circuit boards, if compressed air contains oil, it will damage expensive semiconductor components.

2. Dust Requirements

• Requirements: The concentration of particulate matter in air compressed air must be extremely low, and the particulate matter concentration is usually required to be less than 100 pieces per cubic foot, or even below 0.01μm.
• Cause: Tiny dust particles may cause failure of semiconductor packaging components. During semiconductor manufacturing, any tiny impurities can cause damage to precision circuits.

3. Dew point requirements

• Requirements: The dew point requirements of air compressed air are usually between -40℃ and -70℃.
• Reason: Dew point temperature is an important indicator to measure the moisture content in compressed air. Semiconductor packaging components are extremely sensitive to humidity, and excessive moisture will affect the performance and reliability of the components.

4. Requirements for microbial and chemical pollutants

• Requirements: The concentration of microbial and chemical pollutants in air compressed air must be lower than a certain standard.
• Cause: Microbial and chemical pollutants may contaminate semiconductor packaging components, affecting the performance and reliability of components. Especially in clean room environments, the content of microbial and chemical pollutants must be strictly controlled.

5. Pressure requirements

• Requirements: The pressure of air compressed air should be kept within a stable range to ensure the smooth progress of the production process.
• Reason: During semiconductor packaging, many precision devices require a stable supply of compressed air to drive. Unstable pressure may affect theThe normal operation and product quality are provided.

In summary, the requirements for air compressed air quality of semiconductor packaging components cover multiple aspects such as oil, dust, dew point, microbial and chemical pollutants, and pressure. These requirements are designed to ensure the cleanliness of the production environment of semiconductor packaging components and the quality of the product. Therefore, during the semiconductor packaging process, the quality of air compressed air must be strictly controlled to meet production needs.